Boyd Corporation Thermal Management Products

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Boyd Corporation acquired Kunze Folien GmbH in 2017, a company recognized as one of the leading providers of customized heat management solutions. As the demands for both manufacturing and reliability increase it is very important to understand the complexity and the importance of each component in every application.

  • Conductive Materials

    Thermal pads, Thermo-Silicone caps & tubes, polyimide film, graphite interface materials – click on the link above to view the Conductive Materials range in more detail.

  • Transistor Clips

    POWERCLIPS®‚ through well-engineered clip design provide an integrated “ Heat Management” solution with optimum interaction of transistor clips, interface materials and heat sinks.

  • Cooling Plates

    Boyd Corporation produce a wide range of customised cooling plates and angled cooling plates that will accept their semiconductor clips POWERCLIPS®. AIMg3 is the most common material for these cooling pads but copper, brass etc can also be used and various finishes are available.

    Boyd also provide customer-specific integrated solutions consisting of the cooling plate and the semiconductor clip pre-assembled if required.

     

  • Stamped Heatsinks

    Stamped heat sinks are made from high quality aluminium in a stamping and bending process. These heat sinks are perfect for cooling all standard semiconductor casings. They come with mounting holes for screw connect or clamping with POWERCLIPS®. Various surface finishes are available through well-engineered clip design provide an integrated “ Heat Management” solution with optimum interaction of transistor clips, interface materials and heat sinks.

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